ACB introduces 2nd generation of Copperfill

µVia Cu Fill was an existing process to fill small holes in industrial applications (e.g. mobile phones ). The challenge was to develop a process capable to fill geometries used in the high reliability market. Another challenge was to improve the µVia Cu Fill process to have an average dimple = 0 and to be design independent. ACB qualified today:

cu fill hdi 

75 - 100 - 125 - 150 - 175 µm drilled

in 1 x 1080 - 2 x 106 - 2 x 1080 prepreg

combinations subject of aspect ratio


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ACB nvBE-9200 Dendermondeacb@acb.beATLANTEC sasFR-44260